PEEK-Based Nanocomposites for Extreme-Environment Applications: A Critical Review of Thermal Engineering Strategies, Processing Methods, and Emerging Opportunities in Semiconductor Packaging and Energy Infrastructure

Abstract:

The increasing demand for materials capable of operating under extreme thermal, electrical, and mechanical conditions has accelerated the development of high-performance polymer systems for advanced engineering applications. At a broader level, sectors such as semiconductor packaging and energy infrastructure require materials that can withstand elevated temperatures, aggressive environments, and high-power densities while maintaining structural integrity and functional reliability. Polyether ether ketone (PEEK), a high-performance thermoplastic, has emerged as a leading candidate due to its exceptional thermal stability, chemical resistance, and mechanical robustness. Narrowing the focus, recent research has emphasized the incorporation of nanoscale fillers into PEEK matrices to form nanocomposites with enhanced thermal conductivity, dielectric strength, and durability. These enhancements are achieved through advanced thermal engineering strategies, including filler alignment, interface modification, and hybrid material design, which collectively address the limitations of conventional polymer systems. Furthermore, processing methods such as melt blending, in situ polymerization, and additive manufacturing play a critical role in determining microstructural characteristics and overall performance. This review critically examines the interplay between material design, processing techniques, and functional performance in PEEK-based nanocomposites, highlighting emerging opportunities for their deployment in next-generation semiconductor packaging and resilient energy systems.